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CFMEE

373.000

0.000

Volume:- -

Turnover:- -

Market Cap:54.65B

PE:151.67

High:373.000

Open:373.000

Low:373.000

Close:373.000

52wk High:555.000

52wk Low:228.000

Shares:146.51M

HK Float Shares:14.76M

Volume Ratio:- -

T/O Rate:- -

Dividend:- -

Dividend Rate:- -

EPS(LYR):2.459

ROE:15.28%

ROA:7.80%

PB:19.37

PE(LYR):151.67

PS:27.87

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Overview Company News Filings

HK Grey Market | Keytop Parking Jumps 160%; CFMEE Jumps 66%; WengeAI Jumps 58%; SG Micro Jumps 33%

Tiger Newspress

CFMEE Publishes New Articles of Association Following Hong Kong H-Share Listing, Sets Out Governance Structure and Dividend Policy

Bulletin Express

CFMEE Sets Final Offer Price at HK$252.73 Per Share

CFMEE Prices Hong Kong IPO at HK$252.73 per Share; Trading to Start 26 June 2026

Bulletin Express

CFMEE's Hong Kong IPO Oversubscribed 194 Times, Indicating Strong Investor Demand

CFMEE's Global Ambitions: A New Chapter from the STAR Market to the Hong Kong Exchange

Hong Kong's IPO Pipeline Swells as Six Firms Launch Deals, Eyeing HK$20 Billion in Combined Haul

MT Newswires Live

Circuit Fabology Microelectronics Seeks Up to HK$3.2 Billion in Hong Kong IPO

MT Newswires Live

集成电路光刻设备企业推出全球发售，最高募资逾30亿港元

Bulletin Express

Circuit Fabology Microelectronics Equipment Sets HK$252.73 Top Price for 12.84 Million-Share Hong Kong IPO

Bulletin Express

BRIEF-Circuit Fabology Microelectronics Equipment Co Announces Maximum Offer Price Of HK$252.73 Per H Share Under Global Offfering

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c","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.mtnewswires.com/","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"mtnewswires_news","symbols":["01956","09630","02272","06228","300661","002600","SG9999002463.SGD","03661","01688"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2644279231","title":"Circuit Fabology Microelectronics Seeks Up to HK$3.2 Billion in Hong Kong IPO","url":"https://stock-news.laohu8.com/highlight/detail?id=2644279231","media":"MT Newswires Live","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2644279231?lang=en_us&edition=fundamental","pubTime":"2026-06-17 10:36","pubTimestamp":1781663782,"startTime":"0","endTime":"0","summary":"Circuit Fabology Microelectronics Equipment  launched its Hong Kong initial public offering on Wednesday, seeking to raise up to HK$3.24 billion.The Chinese printed circuit board maker is offering 12.8 million H-shares at an indicative price of HK$240.09 to HK$252.73 per share, according to a Hong Kong bourse filing.The offering comprises 1.28 million shares for Hong Kong investors and 11.55 million shares for international investors, subject to reallocation and the overallotment option.The offer price is expected to be determined by June 24, with allocation results due by June 25, ahead of the company's planned trading debut on June 26.Net proceeds will be used to expand the company's production capacity and research and development capabilities. 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